About 3D Advanced Technologies (3DAT)

3DAT is offering a diverse technology convergence of Nanotechnology and Semiconductor Materials for Photonics Sensor Product Development (Photodetector, Phototransistor), and Microelectronics Component Product Design (BJT), Product Development, Mask Design, Manufacturing Process Flow Mapping and Process Recipes with Full Specifications compliant with MIL Stds and 6-S methodology, Project Engineering Management for New Product Introduction (NPI), Foundry Supply Chain Subcontract Services for High Reliability MIL/Aerospace and Rad Hard Commercial Photonic, Optoelectronics, and Microelectronic discrete devices, including Program Management for Fabless Rapid Prototyping & Pilot-Line Manufacturingincluding , for MIL/Aerospace, Security, Medical, Instrumentation, commercial and scientific applications.

 

Specializing in:

  • Custom High Reliability Photonics/Optoelectronic Product Development
    • Photodetector Sensors (UV,Visible, NIR, SWIR)
    • Phototransistors
    • Si PIN QUAD Fast Response NIR Detectors
    • Lateral and Dual Axis PSDs (Position Sensitive Diodes)
    • Radiation Hard Detectors  (High Reliability & Space Applications)
    • X-Ray Detector Array Imaging  (Medical & Security Applications)
    • SOI and Epi based UltraFast Detectors
    • Nanoporous-Si IR Enhanced Detectors
    • Heterostructure Broadband VIS-NIR-SWIR Photodetetcors
    • QPL High Reliability Bipolar Junction Transistors (BJTs)
    • Radiation Hard BJTs

 

  • NPI (New Product Introduction) Commercialization
  • Photonics Processing Development
  • Mask IC Design & GDSII 
  • Process Flow Integration
  • Advanced Materials for 3D NanoPhotonics
  • Supply Chain support for Photonics R&D Prototyping:

      - Raw Materials: High Resistivity FZ-Si, HP-Si

      - Subcontracting Specialized Process Services:

  • Ion Implantation:
    • Dose Range:    1e11 to 1e16
    • Energy Range: 5KeV to 1MeV
  • PECVD Si3N4(Low Stress): 250Å-10,000Å
  • Sputtering Metallization: Most Metals&Alloys
  • E-Beam Metallization: Most Metals
  • Mask Making: Laser Direct Write 

                          

  • Turn Key Wafer Fab Foundries, Test & Assembly:
    • Si Wafer Fab Foundry
    • III-V Wafer Fab Foundry
    • Wafer Test Facilities
    • Assembly Facilities
    • Analytical Service Facilities
  • Transfer to Pilot Line Manufacturing with Subcontracted Foundries
  • Process Flow Mapping
  • Compiling detailed Process Travelers with Specs. for Foundry
  • Compiling Detailed Specs for Subcontracting
  • Yield Enhancements & SPC Software Selection/Set-Up
  • Total Quality Management evaluation, 6s, FMEA, PFMEA, CA, CI
  • Lean Manufacturing 6s-Plus
  • Technology Capability Evaluation
  • Process Equipment Technology Evaluation & Selection
  • IP Evaluation
  • Value Chain Management
  • Executive Business Management support for Small Business / Start-Ups
  • Technical Support with Business Acquisition/Divestiture transition

 

See "Contact Us" Page for Contact Information.